Power chips are connected to exterior circuits via product packaging, and their efficiency depends on the assistance of the product packaging. In high-power circumstances, power chips are typically packaged as power components. Chip interconnection describes the electric connection on the upper surface of the chip, which is generally aluminum bonding cable in standard components. ^
Conventional power module plan cross-section
At present, industrial silicon carbide power modules still mostly utilize the packaging innovation of this wire-bonded typical silicon IGBT module. They deal with issues such as huge high-frequency parasitic criteria, not enough heat dissipation capability, low-temperature resistance, and inadequate insulation strength, which limit using silicon carbide semiconductors. The display of exceptional efficiency. In order to solve these problems and fully manipulate the big potential benefits of silicon carbide chips, numerous new packaging technologies and solutions for silicon carbide power components have emerged over the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually developed from gold cables to copper cords, and the driving pressure is price reduction; high-power gadgets have actually developed from light weight aluminum wires (strips) to Cu Clips, and the driving force is to improve product performance. The higher the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a strong copper bridge soldered to solder to link chips and pins. Compared to traditional bonding packaging techniques, Cu Clip technology has the following benefits:
1. The link in between the chip and the pins is made of copper sheets, which, to a certain degree, replaces the basic cable bonding method between the chip and the pins. Consequently, an unique plan resistance worth, higher current flow, and far better thermal conductivity can be gotten.
2. The lead pin welding location does not require to be silver-plated, which can fully save the expense of silver plating and poor silver plating.
3. The item look is totally constant with typical products and is generally made use of in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power materials, and other fields.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding approach is much more expensive and complicated, yet it can accomplish better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The source pad makes use of a Clip method, and eviction uses a Wire technique. This bonding technique is somewhat less costly than the all-copper bonding technique, saving wafer location (applicable to very tiny entrance areas). The process is simpler than the all-copper bonding method and can obtain better Rdson and far better thermal impact.
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